Thermal Conductivity Super Insulation Silicone Thermal Gap Pad
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Description:
Therm-Gap 5000 has ultra-high thermal conductivity and can achieve a low interface at relatively low pressures Thermal resistance performance. It is applied to the power device and the heat dissipation aluminum sheet or machine shell, which can effectively remove air and achieve a good filling effect. Therm-Gap 5000 has good insulation and voltage resistance characteristics and thermal stability, making it safe and reliable to use. Therm-Gap 5000 has good flexibility and resilience, which plays a good role in reducing structural stress and protecting the chip.